• DocumentCode
    3776297
  • Title

    Correlation of critical ambient heat load of an orbicular cover sheltering electronics devices

  • Author

    R. Zhao;J. Y. Qian;D.D. Zhan

  • Author_Institution
    Nanjing Research Institute of Electronics and Technology, 210039, China
  • fYear
    2015
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The critical ambient heat load of an orbicular cover sheltering electronics devices was numerically studied with a view to identifying the effects of several parameters, including solar radiant intensity, latitude, geometrical and thermo-physical properties of the orbicular cover, and thermal parameters of the ambient. The results of various working conditions showed that the above mentioned parameters all had effects on the critical ambient heat load. To identify and quantify the effects of these parameters, the results were mathematically processed, and then a correlation of critical ambient heat load was obtained. With this correlation, the critical ambient heat load of electronics devices in any orbicular cover could be calculated quickly regarding to various working conditions.
  • Publisher
    iet
  • Conference_Titel
    Mechatronics (AISM 2015), Fifth Asia International Symposium on
  • Print_ISBN
    978-1-78561-036-3
  • Type

    conf

  • DOI
    10.1049/cp.2015.1547
  • Filename
    7488847