DocumentCode :
3776297
Title :
Correlation of critical ambient heat load of an orbicular cover sheltering electronics devices
Author :
R. Zhao;J. Y. Qian;D.D. Zhan
Author_Institution :
Nanjing Research Institute of Electronics and Technology, 210039, China
fYear :
2015
Firstpage :
1
Lastpage :
4
Abstract :
The critical ambient heat load of an orbicular cover sheltering electronics devices was numerically studied with a view to identifying the effects of several parameters, including solar radiant intensity, latitude, geometrical and thermo-physical properties of the orbicular cover, and thermal parameters of the ambient. The results of various working conditions showed that the above mentioned parameters all had effects on the critical ambient heat load. To identify and quantify the effects of these parameters, the results were mathematically processed, and then a correlation of critical ambient heat load was obtained. With this correlation, the critical ambient heat load of electronics devices in any orbicular cover could be calculated quickly regarding to various working conditions.
Publisher :
iet
Conference_Titel :
Mechatronics (AISM 2015), Fifth Asia International Symposium on
Print_ISBN :
978-1-78561-036-3
Type :
conf
DOI :
10.1049/cp.2015.1547
Filename :
7488847
Link To Document :
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