Abstract :
Much focus has been placed on the thermal management of electronics in recent years. An overall reduction in size of electronic components as well as advances in chip technology, leading to ever higher power dissipation, have increased the necessity for innovative cooling designs. As a new generation of electronic packaging material, Diamond/Cu composites have excellent performances such as high thermal conductivity and adjustable CTE. In the present work, experimental studies have been conducted to reveal the feasibility of Diamond/Cu composites in industrial applications, and then the technical processing of its plating and welding was obtained. Moreover, the simulation tests of its thermal properties and harsh-environment-hardiness were conducted. The results validated that the use of Diamond/Cu in solid-state microwave power module´s thermal design is feasible.
