DocumentCode :
3779752
Title :
Formation of Si-on-insulator structure by lateral solid phase epitaxial growth with local P-doping
Author :
M. Moniwa;M. Miyao;T. Warabisako;K. Kusukawa;E. Murakami;S. Shukuri
Author_Institution :
Central Research Laboratory. Hitachi Ltd., Kokubunj i. Tokyo 185. Japan
fYear :
1987
fDate :
5/1/1987 12:00:00 AM
Firstpage :
89
Lastpage :
90
Abstract :
A low temperature process for silicon-on-insulator (SOI) formation is essential to realize future 3-dimonsional large scale Integrated circuit (LSI). For this purpose, lateral solid phase epitaxial growth (L-SPE) in deposited amorphous Si (a-Si) films on SiO2 has been studied recently. However, the L-SPE growth Is limited to a few μm from the seeding-area. Doping of a-Si with P atoms increased the L-SPE length to a maximum of 40 μm1). However. SOI with a high P uoncentration is not suitable to be used as a substrate for active device fabrication.
Keywords :
"Annealing","Stress","Silicon","Films","Doping","Substrates","Fabrication"
Publisher :
ieee
Conference_Titel :
VLSI Technology, 1987. SymVLSITech 1987. Symposium on
Print_ISBN :
978-1-5090-3151-1
Type :
conf
Filename :
7508777
Link To Document :
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