An improved physic-based model for via structures embedded in layered media

In this paper, an improved physics-based model is introduced for vias embedded in layered media between two parallel-plate pairs. The model is constituted by upper and lower-via-to-plane capacitances and equivalent impedance matrix of the parallel-plate cavity. The via-to-plate capacitance is extracted by Q3D and the parallel-plate impedance is calculated by using the cavity resonator method (CRM) as well as equivalent wave number. For the first time, this circuit model is presented in this paper for the issue of layered media, which is much simpler with sufficient accuracy up to 20GHz when compared with analytical method. The modelis validated with full-wave simulations.