DocumentCode
3783593
Title
Relationships among properties of sputtered thin films and sputtering process parameters
Author
M. Kolar;P. Mach
Author_Institution
Dept. of Electrotechnol., Czech Tech. Univ., Prague, Czech Republic
fYear
2001
fDate
6/23/1905 12:00:00 AM
Firstpage
42
Lastpage
46
Abstract
This paper focuses on the investigation of the influence of process parameters (pressure, applied power, sputtering time) during the radio frequency magnetron sputtering of nickel, aluminum and combined aluminum-silicon on properties of thin films. The experiments were carried out on the BALZERS PLS 160 radio frequency magnetron sputtering unit, using an argon atmosphere. The sheet resistance and the thickness of the films were measured. The influence of temperature on the sheet resistance was examined as well.
Keywords
"Sputtering","Radio frequency","Nickel","Aluminum","Magnetic properties","Argon","Atmosphere","Atmospheric measurements","Electrical resistance measurement","Thickness measurement"
Publisher
ieee
Conference_Titel
Electronics Technology: Concurrent Engineering in Electronic Packaging, 2001. 24th International Spring Seminar on
Print_ISBN
0-7803-7111-9
Type
conf
DOI
10.1109/ISSE.2001.931006
Filename
931006
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