Title :
Implementation and prospects for chip-to-chip free-space optical interconnects
Author_Institution :
Sch. of Eng., Univ. of California, La Jolla, CA, USA
fDate :
6/23/1905 12:00:00 AM
Abstract :
This paper describes the state of the art in free space optical interconnects as applied to chip-to-chip communication. We will review various technologies that integrate micro lasers and optical detectors with silicon CMOS, provide optical link characteristics obtained with these devices, and discuss the capabilities of low cost and robust optoelectronic packaging techniques to seamlessly integrate optics and electronics at the board level.
Keywords :
"Optical interconnections","Space technology","CMOS technology","Optical detectors","Silicon","Optical fiber communication","Costs","Robustness","Electronics packaging","Integrated optics"
Conference_Titel :
Electron Devices Meeting, 2001. IEDM ´01. Technical Digest. International
Print_ISBN :
0-7803-7050-3
DOI :
10.1109/IEDM.2001.979564