Title :
Evaluation of board level reliability of Pb-free PBGA solder joints
Author :
Lee, Shi-Wei Ricky ; Lui, B.H.W.
Author_Institution :
Electron. Packaging Lab., Hong Kong Univ. of Sci. & Technol., Kowloon, China
Abstract :
The present study is intended to evaluate the board level reliability of PBGA assemblies under thermal and mechanical loading. The main objective is to characterize the reliability of Pb-free solder joints with various assembly conditions. For the purpose of benchmarking, specimens with conventional Sn-Pb eutectic solder are tested in parallel as well. During the course of this study, a five-leg experiment is designed with various combinations of solder materials and peak reflow temperatures. The reliability tests include temperature cycling, three-point bending, and random vibration. It is found that the Pb-free solder joints have a much longer thermal fatigue life than the 63Sn-37Pb solder. Although there is no significant difference, the 63Sn-37Pb solder joints seem to perform slightly better than the Pb-free solder under the mechanical loading
Keywords :
ball grid arrays; bending; plastic packaging; reflow soldering; reliability; thermal stress cracking; vibrations; PBGA solder joint; Pb-free alloy; Sn-Pb; Sn-Pb eutectic alloy; board level reliability; mechanical loading; random vibration; reflow temperature; temperature cycling; thermal fatigue life; thermal loading; three-point bending; Assembly; Benchmark testing; Chip scale packaging; Circuit testing; Electronic packaging thermal management; Electronics packaging; Laboratories; Plastic integrated circuit packaging; Soldering; Temperature;
Conference_Titel :
Advanced Packaging Materials, 2002. Proceedings. 2002 8th International Symposium on
Conference_Location :
Stone Mountain, GA
Print_ISBN :
0-7803-7434-7
DOI :
10.1109/ISAPM.2002.990368
