DocumentCode
378538
Title
Bi-block copolymer surfactant study for high dielectric constant polymer-ceramic composite
Author
Rao, Yang ; Takahashi, Atsushi ; Wong, C.P.
Author_Institution
Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear
2002
fDate
2002
Firstpage
188
Lastpage
193
Abstract
Embedded capacitor technology can improve electrical performance and reduce assembly cost compared with traditional discrete capacitor technology. Polymer-ceramic composites have been of great interest as embedded capacitor material because they combine the processability of polymers with the desired electrical properties of ceramics. Dispersion of ceramic particles is a critical factor to affect the effective dielectric constant of polymer ceramic composite. Bi-block copolymer surfactants have been used to prevent agglomeration of the ceramic particles. It was found that bi-block copolymer surfactant can improve the ceramic dispersion better than monomer surfactant. Using bi-block copolymer surfactant, higher dielectric constant was achieved at lower ceramic loading level. This high dielectric constant polymer ceramic composite material has much better mechanical properties and can be used for the integral capacitors in the SOP (system on a package) substrate
Keywords
capacitors; dielectric materials; filled polymers; permittivity; polymer blends; surfactants; bi-block copolymer surfactant; ceramic dispersion; dielectric constant; electrical properties; embedded capacitor; high-k dielectric material; integral passive component; mechanical properties; polymer-ceramic composite; system-on-a-package substrate; Assembly; Capacitors; Ceramics; Composite materials; Costs; Dielectric constant; Dielectric materials; Dispersion; High-K gate dielectrics; Polymers;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging Materials, 2002. Proceedings. 2002 8th International Symposium on
Conference_Location
Stone Mountain, GA
Print_ISBN
0-7803-7434-7
Type
conf
DOI
10.1109/ISAPM.2002.990385
Filename
990385
Link To Document