• DocumentCode
    3785576
  • Title

    Low dielectric constant materials for IC applications [Book Review]

  • Author

    J.J. Shea

  • Volume
    20
  • Issue
    2
  • fYear
    2004
  • Firstpage
    53
  • Lastpage
    54
  • Keywords
    "Book reviews","Dielectric constant","Dielectric materials","Application specific integrated circuits","Vibrations","Heat transfer","Integrated circuit interconnections","Copper","Chemical vapor deposition","Polymers"
  • Journal_Title
    IEEE Electrical Insulation Magazine
  • Publisher
    ieee
  • ISSN
    0883-7554
  • Type

    jour

  • DOI
    10.1109/MEI.2004.1283280
  • Filename
    1283280
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3785576