Title :
A trial for integrating front end circuits on a substrate of SAW device employing ELO film bonding process
Author :
Aoki, Y. ; Kaneshiro, C. ; Koh, K. ; Nam, S.M. ; Hohkawa, K.
Author_Institution :
Adv. Technol. Res. Center, Kanagawa Inst. of Technol., Japan
Abstract :
This paper presents a preliminary study on the one chip front-end integrated circuit. We discussed the basic problems of co-integration circuit. We also proposed several novel semiconductor coupled SAW functional devices and shown basic characteristics of these devices using circuit simulator. Using the epitaxial liftoff film bonding technology, we fabricated basic test circuits such as pass exchanger on LiNbO3 substrate and measured basic characteristics of circuits
Keywords :
epitaxial layers; integrated circuit bonding; lithium compounds; surface acoustic wave devices; LiNbO3; LiNbO3 substrate; circuit simulator; co-integration circuit; epitaxial liftoff film bonding technology; one-chip front-end integrated circuit; pass exchanger; semiconductor coupled SAW device; Bonding; Circuit simulation; Coupling circuits; Integrated circuit technology; Optical amplifiers; Resonator filters; Semiconductor optical amplifiers; Substrates; Surface acoustic wave devices; Surface acoustic waves;
Conference_Titel :
Ultrasonics Symposium, 2001 IEEE
Conference_Location :
Atlanta, GA
Print_ISBN :
0-7803-7177-1
DOI :
10.1109/ULTSYM.2001.991572
