A trial for integrating front end circuits on a substrate of SAW device employing ELO film bonding process

Author

Aoki, Y. ; Kaneshiro, C. ; Koh, K. ; Nam, S.M. ; Hohkawa, K.

Author_Institution

Adv. Technol. Res. Center, Kanagawa Inst. of Technol., Japan

Volume

1

fYear

2001

fDate

2001

Firstpage

31

Abstract

This paper presents a preliminary study on the one chip front-end integrated circuit. We discussed the basic problems of co-integration circuit. We also proposed several novel semiconductor coupled SAW functional devices and shown basic characteristics of these devices using circuit simulator. Using the epitaxial liftoff film bonding technology, we fabricated basic test circuits such as pass exchanger on LiNbO₃ substrate and measured basic characteristics of circuits

Keywords

epitaxial layers; integrated circuit bonding; lithium compounds; surface acoustic wave devices; LiNbO₃; LiNbO₃ substrate; circuit simulator; co-integration circuit; epitaxial liftoff film bonding technology; one-chip front-end integrated circuit; pass exchanger; semiconductor coupled SAW device; Bonding; Circuit simulation; Coupling circuits; Integrated circuit technology; Optical amplifiers; Resonator filters; Semiconductor optical amplifiers; Substrates; Surface acoustic wave devices; Surface acoustic waves;

fLanguage

English

Publisher

ieee

Conference_Titel

Ultrasonics Symposium, 2001 IEEE

Conference_Location

Atlanta, GA

Print_ISBN

0-7803-7177-1

Type

conf

DOI

10.1109/ULTSYM.2001.991572

Filename

991572