DocumentCode
3785654
Title
Foreword Contributions from Thermal Investigations of ICs and Systems (THERMINIC)
Author
C.J.M. Lasance;V. Szekely
Volume
27
Issue
1
fYear
2004
Firstpage
79
Lastpage
80
Keywords
"Conferences","Packaging","Components, packaging, and manufacturing technology","Testing","Boundary conditions","Multichip modules","Temperature","Thermal conductivity","Thermal stresses","Stress measurement"
Journal_Title
IEEE Transactions on Components and Packaging Technologies
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2004.827946
Filename
1288308
Link To Document