DocumentCode :
3785656
Title :
Open Forum Editorial
Author :
M.G. Pecht
Volume :
27
Issue :
1
fYear :
2004
Firstpage :
224
Lastpage :
224
Journal_Title :
IEEE Transactions on Components and Packaging Technologies
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2004.827638
Filename :
1288329
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3785656
