• DocumentCode
    378574
  • Title

    Investigation of SAW-induced acoustomigration effects in Cu- and Al-based metallizations

  • Author

    Schmidt, H. ; Menzel, S. ; Weihnacht, M. ; Kunze, R.

  • Author_Institution
    Vectron Int.-TELEFILTER, Teltow, Germany
  • Volume
    1
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    97
  • Abstract
    Surface acoustic wave (SAW) filter devices are successfully used for a variety of applications in telecommunication at low power levels. Shrinking sizes, raising frequencies and higher power levels lead now to new requirements regarding the device power capability since the metal electrodes tend to fatigue under high load due to acoustomigration effects. A lot of work was done to study the influence of several Al alloys and layered systems on the power durability usually by loading an existent layout with high power. By contrast, we have started our comparative investigations with in-situ experiments on different test metallizations, in order to gain a deeper insight into the acoustomigration phenomena and the basic mechanisms. These observations gave the experimental counterpart to the theoretical work on modeling the SAW stress fields. First results show clear differences in the migration behavior of Cu-based and Al-based metallization systems, with a significant higher power durability for the Cu systems
  • Keywords
    aluminium alloys; copper alloys; diffusion; metallisation; reliability; surface acoustic wave filters; ultrasonic effects; Al alloys; Al-based metallization; Cu alloys; Cu-based metallization; SAW filter devices; SAW-induced acoustomigration effects; device power capability; in-situ experiments; metal electrodes; migration behavior; power durability; stress modelling; surface acoustic wave filter; Acoustic testing; Acoustic waves; Aluminum alloys; Electrodes; Fatigue; Filters; Frequency; Metallization; Surface acoustic wave devices; Surface acoustic waves;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2001 IEEE
  • Conference_Location
    Atlanta, GA
  • Print_ISBN
    0-7803-7177-1
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2001.991587
  • Filename
    991587