Title :
Electromechanical coupling factor k352 of thickness-shear mode of the piezoelectric thin films deposited on substrates
Author :
Chao, Min-Chiang ; Wu, Tsung-Ying ; Zuoqing Wang ; Chih-Lin Wang
Author_Institution :
TXC Corp. Ltd., Tao-Yuan, Taiwan
Abstract :
An experimental method for characterizing piezoelectric film, which is deposited on a substrate plate to form a thickness-shear wave high-overmode bulk acoustic resonator (HBAR), will be presented in this paper. Based on the parallel and series resonant frequency spectra of the HBAR, the electromechanical coupling factor of the piezoelectric film operating in thickness-shear mode can be evaluated directly. Numerical simulation results of samples consisting of ZnO film on fused SiO2 substrate are carried out to show the validity of the method. The effect of the electrodes is compensated by a modified formula
Keywords :
bulk acoustic wave devices; electrodes; piezoelectric thin films; zinc compounds; ZnO-SiO2; electrodes; electromechanical coupling factor; high-overmode bulk acoustic resonator; piezoelectric thin films; series resonant frequency spectra; substrate plate; thickness-shear mode; Acoustic waves; Electrodes; Film bulk acoustic resonators; Impedance; Piezoelectric films; Resonance; Resonant frequency; Semiconductor films; Substrates; Zinc oxide;
Conference_Titel :
Ultrasonics Symposium, 2001 IEEE
Conference_Location :
Atlanta, GA
Print_ISBN :
0-7803-7177-1
DOI :
10.1109/ULTSYM.2001.991664
