3786318

Introduction to the Special Issue on Interface Reliability II

R. Blish;A. Christou;G. Samuelson;B. Thomas

4

2

2004

127

128

"Special issues and sections","Adhesives","Copper","Thermal stresses","Semiconductor device reliability","Delamination","Chemical technology","Tensile stress","Heating","Thermal expansion"

IEEE Transactions on Device and Materials Reliability

ieee

1530-4388

jour

10.1109/TDMR.2004.831988

1318615