DocumentCode :
3786344
Title :
Chip scale packaging for modern electronics - Book Review
Author :
J. Fjelstad;R. Ghaffarian;Y.-G. Kim
Author_Institution :
Electrochemical Publications
Volume :
20
Issue :
4
fYear :
2004
Firstpage :
47
Lastpage :
47
Keywords :
"Book reviews","Chip scale packaging","Wafer scale integration","Encyclopedias","Electronics packaging","Integrated circuit packaging","Sections","Consumer electronics","Plastic packaging","Aerospace materials"
Journal_Title :
IEEE Electrical Insulation Magazine
Publisher :
ieee
ISSN :
0883-7554
Type :
jour
DOI :
10.1109/MEI.2004.1318852
Filename :
1318852
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3786344
