DocumentCode :
3786345
Title :
Fluoroplastics, vol. 1 - non-melt processible fluoroplastics - Book Review
Author :
S. Ebnesajjad
Author_Institution :
Knovel Corporation
Volume :
20
Issue :
4
fYear :
2004
Firstpage :
47
Lastpage :
47
Keywords :
"Book reviews","Chip scale packaging","Sections","Wafer scale integration","Plastics","Mechanical factors","Electronics packaging","Integrated circuit packaging","Dielectric constant","Dielectric losses"
Journal_Title :
IEEE Electrical Insulation Magazine
Publisher :
ieee
ISSN :
0883-7554
Type :
jour
DOI :
10.1109/MEI.2004.1318853
Filename :
1318853
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3786345
