DocumentCode
3786521
Title
Foreword Special Issue on System-On-Package (SOP)
Author
R.R. Tummala
Volume
27
Issue
2
fYear
2004
Firstpage
239
Lastpage
240
Keywords
"Optical device fabrication","Electromagnetic interference","Electronics packaging","Signal design","Assembly","Pulp manufacturing","Moore´s Law","Transistors","Radio frequency","Optical sensors"
Journal_Title
IEEE Transactions on Advanced Packaging
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.2004.828809
Filename
1331505
Link To Document