• DocumentCode
    3786611
  • Title

    Devices and packaging for wireless communications

  • Volume
    5
  • Issue
    3
  • fYear
    2004
  • Firstpage
    95
  • Lastpage
    95
  • Keywords
    "Packaging","Wireless communication","Power system management","Technology management","Wafer scale integration","Bonding","Communications technology","Semiconductor device noise","Linearity","Computer displays"
  • Journal_Title
    IEEE Microwave Magazine
  • Publisher
    ieee
  • ISSN
    1527-3342
  • Type

    jour

  • DOI
    10.1109/MMW.2004.1337793
  • Filename
    1337793
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3786611