Title :
High performance piezoceramic films on substrates for high frequency imaging
Author :
Levassort, F. ; Hue, L. P Tran Huu ; Holc, J. ; Bove, T. ; Kosec, M. ; Lethiecq, M.
Abstract :
PZT thick film fabrication process by screen-printing on two substrates (alumina and PZT) is first described. The firing temperature of the PZT layers is only 800°C since the composition was modified with lead germanate (PGO). This minimizes lead losses in films during sintering. The characterization of the samples considered as four layer elements (with electrodes) reveals high electromechanical performance of the films (thickness around 40 μm) since the measured thickness coupling factor is around 50%. The results are used to simulate single element high frequency transducers with a KLM model where the substrate is directly used as a backing for an integrated device
Keywords :
lead compounds; piezoceramics; printing; sintering; thick films; ultrasonic imaging; ultrasonic transducers; 20 MHz; 40 micron; 800 degC; Al2O3; KLM model; PZT; PZT substrates; PZT thick film fabrication process; PZT-Al2O3; PbZrO3TiO3; PbZrO3TiO3-Al2O3; US imaging; alumina substrate; electromechanical performance; firing temperature; four layer elements; high frequency imaging; high performance piezoceramic films; screen printing; single element HF transducers; Electrodes; Fabrication; Firing; Frequency; Piezoelectric materials; Substrates; Temperature; Thick films; Thickness measurement; Transducers;
Conference_Titel :
Ultrasonics Symposium, 2001 IEEE
Conference_Location :
Atlanta, GA
Print_ISBN :
0-7803-7177-1
DOI :
10.1109/ULTSYM.2001.991896
