Title :
Recycling of wastewater generated from semiconductor processing factories
Author :
Nishimura, Masashi ; Kiyohara, Masao ; Sugiyama, Kohichi
Author_Institution :
Ricoh Co. Ltd., Japan
Abstract :
Recycling of HF wastewater from wafer process is essential to be a zero emission semiconductor factory. Silicon dioxide etchant is one of the most consumed HF chemical used during wafer process. It is often used as a cleaning solvent for cleaning of equipment parts. This article provides information on a new wastewater treatment system installed at Ricoh Electronic Devices Company´s Yashiro factory. For the first time in the world, HF raw material is being recycled. Also presented will be wastewater treatment cost and performance data
Keywords :
etching; hydrogen compounds; integrated circuit manufacture; recycling; water treatment; HF; Ricoh Electronic Devices Company; SiO2; Yashiro factory; cleaning solvent; recycling; semiconductor processing factories; silicon dioxide etchant; wafer process; wastewater; zero emission semiconductor factory; Chemical processes; Cleaning; Etching; Hafnium; Production facilities; Raw materials; Recycling; Silicon compounds; Solvents; Wastewater treatment;
Conference_Titel :
Environmentally Conscious Design and Inverse Manufacturing, 2001. Proceedings EcoDesign 2001: Second International Symposium on
Conference_Location :
Tokyo
Print_ISBN :
0-7695-1266-6
DOI :
10.1109/.2001.992427
