• DocumentCode
    3787388
  • Title

    Introduction to the Special Issue on Thermal Management for Reliability

  • Author

    P.J. Boudreaux

  • Volume
    4
  • Issue
    4
  • fYear
    2004
  • Firstpage
    566
  • Lastpage
    567
  • Keywords
    "Special issues and sections","Thermal management","Materials reliability","Thermal resistance","Cooling","Integrated circuit reliability","Thermal force","Technology management","Reliability engineering","Integrated circuit technology"
  • Journal_Title
    IEEE Transactions on Device and Materials Reliability
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2004.839127
  • Filename
    1388427