DocumentCode
378747
Title
Environmental impact evaluation for the full life cycle of products using Pb-free solders
Author
Hamano, Hideyuki ; Suga, Tadatomo ; Okamoto, Masahide ; Otmar, Deubzer
Author_Institution
Tokyo Univ., Japan
fYear
2001
fDate
2001
Firstpage
1079
Lastpage
1083
Abstract
The electronics industry is heading towards lead-free soldering. But lead-free soldering faces some obstacles, for example cost, resource depletion, energy consumption, and the characteristics of the solder itself etc. The problem of energy consumption is not yet clear. We examined the energy consumption of PWB with lead-free solder comparing to the conventional tin-lead solder. The results show that lead-free soldering will increase the energy consumption. But this increase of energy occupies about only 0.1% of the energy consumption in the electronics industry. Meanwhile, if this increase triggers replacement with a new reflow oven, the energy consumption of PWB with lead-free solder is less than present systems
Keywords
environmental factors; printed circuit manufacture; reflow soldering; PWB; cost; electronics industry; energy consumption; environmental impact evaluation; full life cycle; lead-free solders; reflow oven; resource depletion; Composite materials; Costs; Electronics industry; Energy consumption; Environmentally friendly manufacturing techniques; Lead; Ovens; Production; Recycling; Soldering;
fLanguage
English
Publisher
ieee
Conference_Titel
Environmentally Conscious Design and Inverse Manufacturing, 2001. Proceedings EcoDesign 2001: Second International Symposium on
Conference_Location
Tokyo
Print_ISBN
0-7695-1266-6
Type
conf
DOI
10.1109/.2001.992526
Filename
992526
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