• DocumentCode
    378747
  • Title

    Environmental impact evaluation for the full life cycle of products using Pb-free solders

  • Author

    Hamano, Hideyuki ; Suga, Tadatomo ; Okamoto, Masahide ; Otmar, Deubzer

  • Author_Institution
    Tokyo Univ., Japan
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    1079
  • Lastpage
    1083
  • Abstract
    The electronics industry is heading towards lead-free soldering. But lead-free soldering faces some obstacles, for example cost, resource depletion, energy consumption, and the characteristics of the solder itself etc. The problem of energy consumption is not yet clear. We examined the energy consumption of PWB with lead-free solder comparing to the conventional tin-lead solder. The results show that lead-free soldering will increase the energy consumption. But this increase of energy occupies about only 0.1% of the energy consumption in the electronics industry. Meanwhile, if this increase triggers replacement with a new reflow oven, the energy consumption of PWB with lead-free solder is less than present systems
  • Keywords
    environmental factors; printed circuit manufacture; reflow soldering; PWB; cost; electronics industry; energy consumption; environmental impact evaluation; full life cycle; lead-free solders; reflow oven; resource depletion; Composite materials; Costs; Electronics industry; Energy consumption; Environmentally friendly manufacturing techniques; Lead; Ovens; Production; Recycling; Soldering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Environmentally Conscious Design and Inverse Manufacturing, 2001. Proceedings EcoDesign 2001: Second International Symposium on
  • Conference_Location
    Tokyo
  • Print_ISBN
    0-7695-1266-6
  • Type

    conf

  • DOI
    10.1109/.2001.992526
  • Filename
    992526