DocumentCode :
378747
Title :
Environmental impact evaluation for the full life cycle of products using Pb-free solders
Author :
Hamano, Hideyuki ; Suga, Tadatomo ; Okamoto, Masahide ; Otmar, Deubzer
Author_Institution :
Tokyo Univ., Japan
fYear :
2001
fDate :
2001
Firstpage :
1079
Lastpage :
1083
Abstract :
The electronics industry is heading towards lead-free soldering. But lead-free soldering faces some obstacles, for example cost, resource depletion, energy consumption, and the characteristics of the solder itself etc. The problem of energy consumption is not yet clear. We examined the energy consumption of PWB with lead-free solder comparing to the conventional tin-lead solder. The results show that lead-free soldering will increase the energy consumption. But this increase of energy occupies about only 0.1% of the energy consumption in the electronics industry. Meanwhile, if this increase triggers replacement with a new reflow oven, the energy consumption of PWB with lead-free solder is less than present systems
Keywords :
environmental factors; printed circuit manufacture; reflow soldering; PWB; cost; electronics industry; energy consumption; environmental impact evaluation; full life cycle; lead-free solders; reflow oven; resource depletion; Composite materials; Costs; Electronics industry; Energy consumption; Environmentally friendly manufacturing techniques; Lead; Ovens; Production; Recycling; Soldering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Environmentally Conscious Design and Inverse Manufacturing, 2001. Proceedings EcoDesign 2001: Second International Symposium on
Conference_Location :
Tokyo
Print_ISBN :
0-7695-1266-6
Type :
conf
DOI :
10.1109/.2001.992526
Filename :
992526
Link To Document :
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