• DocumentCode
    3787492
  • Title

    Foreword to the Special Section of the Asian Green Electronics Conference (AGEC)

  • Author

    J. Liu;H. JorgenGriese;Y.C. Chan

  • Volume
    27
  • Issue
    4
  • fYear
    2004
  • Firstpage
    213
  • Lastpage
    214
  • Keywords
    "Consumer electronics","Electronics packaging","Components, Packaging, and Manufacturing Technology Society","Environmentally friendly manufacturing techniques","Lead","Materials science and technology","Soldering","Conductive adhesives","Components, packaging, and manufacturing technology","Books"
  • Journal_Title
    IEEE Transactions on Electronics Packaging Manufacturing
  • Publisher
    ieee
  • ISSN
    1521-334X
  • Type

    jour

  • DOI
    10.1109/TEPM.2005.844477
  • Filename
    1393082
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3787492