3787630

Foreword Contributions From Thermal Investigations of ICs and Systems (THERMINIC)

C.J.M. Lasance;M. Rencz

28

1

2005

3

4

"Thermal resistance","Testing","Components, packaging, and manufacturing technology","Packaging","Cooling","Thermal management","Equations","Fingers","Heterojunction bipolar transistors","Electrical resistance measurement"

IEEE Transactions on Components and Packaging Technologies

ieee

1521-3331

jour

10.1109/TCAPT.2004.843178

1402605