DocumentCode :
3787631
Title :
Open Forum Editorial
Author :
M.G. Pecht
Volume :
28
Issue :
1
fYear :
2005
Firstpage :
165
Lastpage :
165
Journal_Title :
IEEE Transactions on Components and Packaging Technologies
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2005.845157
Filename :
1402627
Link To Document :
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