DocumentCode
378767
Title
Advanced lithography for high aspect ratio MEMS technology
Author
Islam, Rafiqul ; Brubaker, Chad
Author_Institution
EV Group Inc, Phoenix, AZ, USA
fYear
2001
fDate
2001
Firstpage
77
Lastpage
79
Abstract
MEMS (microelectromechanical systems) devices require thick and high aspect ratio film processing for their novel microstructures. The development of high-aspect-ratio processing, in which the vertical dimensions can be large compared to the lateral dimensions, has made it possible to move from planar to three-dimensional micromechanical structures. High aspect ratio microstructures can The fabricated by deep X-ray lithography, energy beams and physical cutting tools, and replication in metals, plastics, and ceramics. is paper investigated fabrication methods for high aspect ratio microstructures
Keywords
X-ray lithography; cutting; micromechanical devices; MEMS technology; aspect ratio; deep X-ray lithography; fabrication methods; lateral dimensions; physical cutting tools; three-dimensional structures; vertical dimensions; Coatings; Etching; Fabrication; Lithography; Micromechanical devices; Microstructure; Plastics; Resists; Solvents; Synchrotrons;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectromechanical Systems Conference, 2001
Conference_Location
Berkeley, CA
Print_ISBN
0-7803-7224-7
Type
conf
DOI
10.1109/MEMSC.2001.992746
Filename
992746
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