Title :
Advanced lithography for high aspect ratio MEMS technology
Author :
Islam, Rafiqul ; Brubaker, Chad
Author_Institution :
EV Group Inc, Phoenix, AZ, USA
Abstract :
MEMS (microelectromechanical systems) devices require thick and high aspect ratio film processing for their novel microstructures. The development of high-aspect-ratio processing, in which the vertical dimensions can be large compared to the lateral dimensions, has made it possible to move from planar to three-dimensional micromechanical structures. High aspect ratio microstructures can The fabricated by deep X-ray lithography, energy beams and physical cutting tools, and replication in metals, plastics, and ceramics. is paper investigated fabrication methods for high aspect ratio microstructures
Keywords :
X-ray lithography; cutting; micromechanical devices; MEMS technology; aspect ratio; deep X-ray lithography; fabrication methods; lateral dimensions; physical cutting tools; three-dimensional structures; vertical dimensions; Coatings; Etching; Fabrication; Lithography; Micromechanical devices; Microstructure; Plastics; Resists; Solvents; Synchrotrons;
Conference_Titel :
Microelectromechanical Systems Conference, 2001
Conference_Location :
Berkeley, CA
Print_ISBN :
0-7803-7224-7
DOI :
10.1109/MEMSC.2001.992746
