• DocumentCode
    3787793
  • Title

    Thermal design of electronic circuit boards and packages [Book Review]

  • Author

    J.J. Shea

  • Volume
    21
  • Issue
    2
  • fYear
    2005
  • Firstpage
    56
  • Lastpage
    57
  • Keywords
    "Book reviews","Electronic packaging thermal management","Electronic circuits","Project management","Electronics packaging","Dielectric materials","Printed circuits","Assembly","Heat transfer","Equations"
  • Journal_Title
    IEEE Electrical Insulation Magazine
  • Publisher
    ieee
  • ISSN
    0883-7554
  • Type

    jour

  • DOI
    10.1109/MEI.2005.1412233
  • Filename
    1412233
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3787793