• DocumentCode
    3788003
  • Title

    Foreword Special Issue on Tin Whiskers

  • Author

    R.W. Gedney

  • Volume
    28
  • Issue
    1
  • fYear
    2005
  • Firstpage
    2
  • Lastpage
    2
  • Keywords
    "Tin","Components, Packaging, and Manufacturing Technology Society","Switches","Coatings","Lead","Electronics packaging","Zinc","Pulp manufacturing","Semiconductor device packaging","Electronics industry"
  • Journal_Title
    IEEE Transactions on Electronics Packaging Manufacturing
  • Publisher
    ieee
  • ISSN
    1521-334X
  • Type

    jour

  • DOI
    10.1109/TEPM.2005.847813
  • Filename
    1430803
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3788003