• DocumentCode
    3788038
  • Title

    Foreword Special Issue of Components and Packaging Technologies With Contributions From ITherm 2004 Thermal Management Track

  • Author

    K. Ramakrishna;B.G. Sammakia;J.R. Culham;Y.K. Joshi

  • Volume
    28
  • Issue
    2
  • fYear
    2005
  • Firstpage
    179
  • Lastpage
    181
  • Keywords
    "Thermal management","Technology management","Heat sinks","Electronic packaging thermal management","Thermal management of electronics","Heat transfer","Phase change materials","Thermal resistance","Speech","Predictive models"
  • Journal_Title
    IEEE Transactions on Components and Packaging Technologies
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2005.848625
  • Filename
    1432926
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3788038