3-D integrable optoelectronic devices for telecommunications ICs

Author

Dainesi, P. ; Ionescu, A.M. ; Thevenaz, L. ; Banerjee, K. ; Declercq, M.J. ; Robert, P. ; Renaud, P. ; Fluckiger, P. ; Hibert, C. ; Racine, G.A.

Author_Institution

Swiss Fed. Inst. of Technol., Lausanne, Switzerland

Volume

1

fYear

2002

fDate

7-7 Feb. 2002

Firstpage

360

Abstract

3-D integrable SOI optoelectronic devices include telecommunication optical switches with 5 MHz bandwidth and unbalanced Mach Zehnder interferometers for filtering. Thermal compensation provides efficient modulation over 100 kHz -1 MHz and addresses 3-D IC thermal issues.

Keywords

CMOS integrated circuits; Mach-Zehnder interferometers; compensation; integrated optoelectronics; photonic switching systems; silicon-on-insulator; telecommunication equipment; 100 kHz to 1 MHz; 3D IC thermal issues; 3D integrable optoelectronic device; 5 MHz; SOI optoelectronic devices; Si; photonic ICs; telecommunication optical switches; telecommunications ICs; thermal compensation; unbalanced Mach Zehnder interferometers; Nonlinear optics; Optical filters; Optical interferometry; Optical modulation; Optical receivers; Optical refraction; Optical variables control; Optoelectronic devices; Silicon; Switches;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Circuits Conference, 2002. Digest of Technical Papers. ISSCC. 2002 IEEE International

Conference_Location

San Francisco, CA, USA

Print_ISBN

0-7803-7335-9

Type

conf

DOI

10.1109/ISSCC.2002.993081

Filename

993081