• DocumentCode
    37894
  • Title

    Decoupled Planar WWAN Antennas With T-Shaped Protruded Ground for Smartphone Applications

  • Author

    Yong-Ling Ban ; Shun Yang ; Zhi Chen ; Kai Kang ; Li, Joshua Le-Wei

  • Author_Institution
    Sch. of Electron. Eng., Univ. of Electron. Sci. & Technol. of China (UESTC), Chengdu, China
  • Volume
    13
  • fYear
    2014
  • fDate
    2014
  • Firstpage
    483
  • Lastpage
    486
  • Abstract
    A planar antenna array composed of two decoupled multiband wireless wide area network (WWAN) antenna elements for slim mobile phone application is presented and studied in this letter. A wide T-shaped protruded ground is deliberately designed to enhance the impedance matching and decouple the two closely deposed antenna elements. The integrity of the proposed T-shaped decoupling structure allows the reuse of space in between the antenna elements in the real applications. With small size occupation, the proposed antenna array covers two wide operating bands including 824-960 and 1710-2170 MHz, and within a short separating distance it achieves isolation better than 12 dB in the lower band and 15 dB in upper band. A prototype is fabricated, and the array´s overall performances are measured and compared to simulated results to validate the proposed solution.
  • Keywords
    UHF antennas; impedance matching; mobile antennas; multifrequency antennas; planar antenna arrays; smart phones; wide area networks; T-shaped protruded ground; decoupled multiband wireless wide area network antenna elements; decoupled planar WWAN antennas; frequency 1710 MHz to 2170 MHz; frequency 824 MHz to 960 MHz; impedance matching; planar antenna array; slim mobile phone application; smartphone applications; Antenna arrays; Antenna measurements; Arrays; MIMO; Mobile antennas; Mobile handsets; Antenna array; decoupling; handset antenna; planar structure; wireless wide area network (WWAN) operation;
  • fLanguage
    English
  • Journal_Title
    Antennas and Wireless Propagation Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1536-1225
  • Type

    jour

  • DOI
    10.1109/LAWP.2014.2309960
  • Filename
    6774434