DocumentCode :
3790208
Title :
Comments on "An analysis of the thermal response of power chip packages"
Author :
T. Harrett
Author_Institution :
STC Components, Ltd., Paignton, England
Volume :
33
Issue :
6
fYear :
1986
Firstpage :
871
Lastpage :
871
Journal_Title :
IEEE Transactions on Electron Devices
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/T-ED.1986.22585
Filename :
1485802
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3790208
