DocumentCode :
3790286
Title :
Cavity-resonance dampening
Author :
P. Dixon
Author_Institution :
Emerson & Cuming Microwave Products, Randolph, MA, USA
Volume :
6
Issue :
2
fYear :
2005
Firstpage :
74
Lastpage :
84
Abstract :
Today, many microwave circuit designers are noticing that their circuits do not perform quite as well as predicted when they enclose their circuit boards within a package. Cavity resonances are generated inside the package that can change the impedances necessary for proper operation of some circuit elements. With frequencies of operation increasing, this is becoming an increasingly prevalent issue in circuit design.
Keywords :
"Resonance","Cutoff frequency","RLC circuits","Microwave circuits","Printed circuits","Packaging","Equations","Conducting materials","Impedance","Circuit synthesis"
Journal_Title :
IEEE Microwave Magazine
Publisher :
ieee
ISSN :
1527-3342
Type :
jour
DOI :
10.1109/MMW.2005.1491270
Filename :
1491270
Link To Document :
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