• DocumentCode
    3790316
  • Title

    Foreword Three-Dimensional Packaging

  • Author

    C.E. Bauer;S.W.R. Lee

  • Volume
    28
  • Issue
    3
  • fYear
    2005
  • Firstpage
    354
  • Lastpage
    355
  • Keywords
    "Silicon","Electronic packaging thermal management","Stacking","Integrated circuit interconnections","Electronics packaging","Through-silicon vias","Sensor arrays","Fabrication","Thermal resistance","Copper"
  • Journal_Title
    IEEE Transactions on Advanced Packaging
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2005.855361
  • Filename
    1492503
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3790316