DocumentCode :
3790427
Title :
Foreword Special Section on ITherm 2004 Mechanics Track
Author :
K. Ramakrishna;B.G. Sammakia;J.H.L. Pang;K. Jonnalagadda
Volume :
28
Issue :
3
fYear :
2005
Firstpage :
387
Lastpage :
389
Keywords :
"Environmentally friendly manufacturing techniques","Lead","Thermal management","Thermomechanical processes","Electronic packaging thermal management","Electronics packaging","Plastic packaging","Copper","Fatigue","Soldering"
Journal_Title :
IEEE Transactions on Components and Packaging Technologies
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2005.856050
Filename :
1501937
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3790427
