DocumentCode
3790722
Title
Foreword Polytronic Special Section
Author
J.E. Morris
Volume
28
Issue
4
fYear
2005
Firstpage
289
Lastpage
290
Keywords
"Components, Packaging, and Manufacturing Technology Society","Components, packaging, and manufacturing technology","Optical polymers","Thermomechanical processes","Optical interconnections","Optical waveguides","Conductive adhesives","Paper technology","Electronics packaging","Computer aided manufacturing"
Journal_Title
IEEE Transactions on Electronics Packaging Manufacturing
Publisher
ieee
ISSN
1521-334X
Type
jour
DOI
10.1109/TEPM.2005.859770
Filename
1522481
Link To Document