• DocumentCode
    3790910
  • Title

    Foreword Polytronic Special Section

  • Author

    J.E. Morris

  • Volume
    28
  • Issue
    4
  • fYear
    2005
  • Firstpage
    741
  • Lastpage
    741
  • Keywords
    "Components, Packaging, and Manufacturing Technology Society","Polymers","Electronics packaging","Costs","Encapsulation","Printed circuits","Integrated circuit interconnections","Microelectronics","Photonics"
  • Journal_Title
    IEEE Transactions on Components and Packaging Technologies
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2005.859661
  • Filename
    1546183
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3790910