• DocumentCode
    3791256
  • Title

    Guest Editorial Contributions From the 13th Topical Meeting on Electrical Performance of Electronic Packaging

  • Author

    R.W. Jackson;M. Cases

  • Volume
    29
  • Issue
    1
  • fYear
    2006
  • Firstpage
    3
  • Lastpage
    4
  • Keywords
    "Electronics packaging","Educational institutions","High-speed electronics","Electromagnetic modeling","Conference proceedings","Components, packaging, and manufacturing technology","Microwave devices","Millimeter wave integrated circuits","Integrated circuit modeling"
  • Journal_Title
    IEEE Transactions on Advanced Packaging
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2005.862642
  • Filename
    1589126
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3791256