• DocumentCode
    3791424
  • Title

    Corrections to "200-mm Wafer Scale Transfer of 0.18$mu$m Dual-Damascene Cu/SiO$_2$Interconnection System to Plastic Substrates"

  • Author

    W.H. Teh;G. Lihui;R. Kumar;D.-L. Kwong

  • Volume
    27
  • Issue
    3
  • fYear
    2006
  • Firstpage
    198
  • Lastpage
    198
  • Keywords
    "Plastics","Laboratories","Microelectronics","Logic devices","Electron devices"
  • Journal_Title
    IEEE Electron Device Letters
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2006.870843
  • Filename
    1599478
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3791424