مرکز منطقه ای اطلاع رساني علوم و فناوري - Corrections to "200-mm Wafer Scale Transfer of 0.18<tex>$mu$</tex>m Dual-Damascene Cu/SiO<tex>$_2$</tex>Interconnection System to Plastic Substrates"

DocumentCode :

3791424

Title :

Corrections to "200-mm Wafer Scale Transfer of 0.18$mu$m Dual-Damascene Cu/SiO$_2$Interconnection System to Plastic Substrates"

Author :

W.H. Teh;G. Lihui;R. Kumar;D.-L. Kwong

Volume :

Issue :

fYear :

2006

Firstpage :

198

Lastpage :

198

Keywords :

"Plastics","Laboratories","Microelectronics","Logic devices","Electron devices"

Journal_Title :

IEEE Electron Device Letters

Publisher :

ieee

ISSN :

0741-3106

Type :

jour

DOI :

10.1109/LED.2006.870843

Filename :

1599478

Link To Document :