• DocumentCode
    3791830
  • Title

    Correction to "A Novel Joint-in-Via Flip-Chip Chip-Scale Package"

  • Author

    T.K. Lee;S. Zhang;C.C. Wong;A.C. Tan

  • Volume
    29
  • Issue
    2
  • fYear
    2006
  • Firstpage
    372
  • Lastpage
    372
  • Keywords
    "Chip scale packaging","Semiconductor device packaging","Biographies","Substrates","Mechanical engineering","Materials science and technology","Electronics packaging","Microelectronics","Micromechanical devices","Asia"
  • Journal_Title
    IEEE Transactions on Advanced Packaging
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2006.873918
  • Filename
    1629181
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3791830