• DocumentCode
    3793512
  • Title

    Introduction to the Special Issue on the IEEE International Symposium on Physical and Failure Analysis of Integrated Circuits

  • Author

    C.H. Tung;J.M. Chin;S. Lim

  • Volume
    6
  • Issue
    2
  • fYear
    2006
  • Firstpage
    181
  • Lastpage
    181
  • Keywords
    "Special issues and sections","Failure analysis","Scanning electron microscopy","Atomic force microscopy","Integrated circuit reliability","Transmission electron microscopy","Integrated circuit packaging","Semiconductor device packaging","Semiconductor device manufacture","Spectroscopy"
  • Journal_Title
    IEEE Transactions on Device and Materials Reliability
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2006.877203
  • Filename
    1673707
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3793512