Fault diagnosis and fault localisation in integrated circuit by thermal method

Author

Bratek, Piotr ; Kos, Andrzej

Author_Institution

Inst. of Electron., Acad. of Min. & Metall., Krakow, Poland

fYear

2001

fDate

29-31 Oct. 2001

Firstpage

230

Lastpage

233

Abstract

In the paper, a thermal testing method for integrated circuits (ICs) is presented. This method compares the real temperature field with the standard field, suitable for the specified energy state of the system. A method of temperature sensor placement strategy is presented as well. This placement method is proposed for fault diagnosis and fault localisation in ICs. An algorithm based on mutual dependencies of average temperatures of selected sub-areas of the IC in order to locate failure is described. Simulation results of the sensor placement strategy and fault diagnosis and localisation are presented. Statistical analyses of the yield of the testing method are shown.

Keywords

fault diagnosis; fault location; fault simulation; integrated circuit testing; integrated circuit yield; temperature distribution; temperature sensors; IC thermal testing method; failure location; fault diagnosis; fault localisation; simulation results; specified energy; temperature field; temperature sensor placement strategy; testing method yield; Circuit faults; Circuit simulation; Circuit testing; Electronic equipment testing; Fault diagnosis; Integrated circuit testing; Multichip modules; Partitioning algorithms; Temperature dependence; Temperature sensors;

fLanguage

English

Publisher

ieee

Conference_Titel

Microelectronics, 2001. ICM 2001 Proceedings. The 13th International Conference on

Print_ISBN

0-7803-7522-X

Type

conf

DOI

10.1109/ICM.2001.997652

Filename

997652