• DocumentCode
    3798494
  • Title

    The Future of DEIS [Editorial]

  • Author

    John Densley

  • Volume
    23
  • Issue
    1
  • fYear
    2007
  • Firstpage
    3
  • Lastpage
    3
  • Keywords
    "Dielectrics and electrical insulation","Societies","Manufacturing","Power engineering and energy","Dielectric materials","Educational institutions","North America","Power engineering","Europe","Superconducting materials"
  • Journal_Title
    IEEE Electrical Insulation Magazine
  • Publisher
    ieee
  • ISSN
    0883-7554
  • Type

    jour

  • DOI
    10.1109/MEI.2007.288449
  • Filename
    4068206
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3798494