DocumentCode
3799182
Title
Prolog to Wafer Direct Bonding: From Advance Substrate Engineering to Future Applications in Micro/Nanoelectronics
Author
Jim Esch
Volume
94
Issue
12
fYear
2006
Firstpage
2058
Lastpage
2059
Keywords
"Wafer bonding","Nanoelectronics","Silicon on insulator technology","Plasma temperature","Substrates","Surface cleaning","Hydrogen","Bonding forces","Annealing","Fabrication"
Journal_Title
Proceedings of the IEEE
Publisher
ieee
ISSN
0018-9219
Type
jour
DOI
10.1109/JPROC.2006.888852
Filename
4077256
Link To Document