DocumentCode :
380088
Title :
EM propagation through the loss substrate interconnect
Author :
Yu, Tiejun
Author_Institution :
Cadence Design Syst. Inc., San Jose, CA, USA
Volume :
2
fYear :
2002
fDate :
2002
Firstpage :
826
Abstract :
One typical way of studying the EM propagation through some medium is treating the transmission medium as the sub-circuit and then using simple circuit theory to do the simulation. Efficient parameter extraction of per-unit length LRCG matrices for multilayer multiconductor transmission interconnects is presented here. Two separate solvers do the extraction. For the LR extraction, the boundary element method is used to solve the full wave integral equations and 2D fast multilayer Green´s function is used to capture the substrate coupling and ground plane effects; conduction mode basis functions are used to efficiently capture the skin effect and proximity effect. For the CG extraction. the boundary spectral method is applied to solve the differential equation. The substrate coupling effects that impact on CG are extracted by enforcing continuity conditions across different dielectric interfaces and the voltage condition on conductor surfaces. After frequency-dependent RLCG matrices are extracted, a robust rational function fitting algorithm generate lumped interconnect models via Gaussian quadrature.
Keywords :
Green´s function methods; boundary-elements methods; circuit simulation; differential equations; electromagnetic wave propagation; integral equations; integrated circuit interconnections; printed circuits; rational functions; skin effect; spectral-domain analysis; substrates; 2D fast multilayer Green function; EM propagation; Gaussian quadrature; LR extraction; boundary element method; boundary spectral method; circuit simulation; circuit theory; conduction mode basis functions; conductor surfaces; continuity conditions; dielectric interfaces; differential equation; frequency-dependent RLCG matrices; full wave integral equations; ground plane effects; loss substrate interconnect; lumped interconnect models; multilayer multiconductor transmission interconnects; parameter extraction; per-unit length LRCG matrices; proximity effect; robust rational function fitting algorithm; skin effect; substrate coupling; voltage condition; Boundary element methods; Character generation; Circuit simulation; Circuit theory; Dielectric substrates; Integral equations; Integrated circuit interconnections; Nonhomogeneous media; Parameter extraction; Propagation losses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Antennas and Propagation Society International Symposium, 2002. IEEE
Print_ISBN :
0-7803-7330-8
Type :
conf
DOI :
10.1109/APS.2002.1016773
Filename :
1016773
Link To Document :
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