3806758

Corrections to "Mini-contact enhanced thermoelectric cooling of hot spots in high power devices"

Bao Yang;Peng Wang;Avram Bar-Cohen

30

4

2007

889

889

"Thermoelectricity","Thermoelectric devices","Cooling","Mechanical engineering","Electronic packaging thermal management","Electronics packaging","Biographies","Terrorism","Numerical simulation","Analytical models"

IEEE Transactions on Components and Packaging Technologies

ieee

1521-3331

jour

10.1109/TCAPT.2007.909249

4380265