DocumentCode
3806758
Title
Corrections to "Mini-contact enhanced thermoelectric cooling of hot spots in high power devices"
Author
Bao Yang;Peng Wang;Avram Bar-Cohen
Volume
30
Issue
4
fYear
2007
Firstpage
889
Lastpage
889
Keywords
"Thermoelectricity","Thermoelectric devices","Cooling","Mechanical engineering","Electronic packaging thermal management","Electronics packaging","Biographies","Terrorism","Numerical simulation","Analytical models"
Journal_Title
IEEE Transactions on Components and Packaging Technologies
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2007.909249
Filename
4380265
Link To Document