DocumentCode

3807222

Title

The Future of DEIS - Editorial

Author

John Densley

Volume

24

Issue

1

fYear

2008

Firstpage

3

Lastpage

3

Journal_Title

IEEE Electrical Insulation Magazine

Publisher

ieee

ISSN

0883-7554

Type

jour

DOI

10.1109/MEI.2008.4455496

Filename

4455496