Integrated avionics system (IAS), integrating 3-D technology on a spacecraft panel

As spacecraft designs converge toward miniaturization, and with the volumetric and mass challenges placed on avionics, programs will continue to advance the "state of the art" in spacecraft system development with new challenges to reduce power, mass and volume. Traditionally, the trend is to focus on high-density component packaging technologies. Although new technologies have improved packaging densities, a system packaging architecture is required that not only reduces spacecraft volume and mass budgets, but increases integration efficiencies, provides modularity and flexibility to accommodate multiple missions while maintaining a low recurring cost. With these challenges in mind, a novel system packaging approach incorporates solutions that provide broader environmental applications and more flexible system interconnectivity. The integrated avionics system (IAS) provides for a low-mass, modular distributed or centralized packaging architecture which combines ridged-flex technologies, high-density COTS hardware and a new 3-D mechanical packaging approach, horizontal mounted cube (HMC). This paper will describe the fundamental elements of the IAS, HMC hardware design, system integration and environmental test results.