Title :
Fabrication and characterization of flexible silicon substrates with electroplated gold leads
Author :
Lisby, Torben Hilligsøe ; Hansen, Ole ; Branebjerg, Jens Anders
Author_Institution :
DELTA Danish Electron., Light & Acoust., Horsholm, Denmark
Abstract :
A study was undertaken to fabricate flexible silicon substrates for high-density packaging. Two different fabrication methods were evaluated to obtain the best mechanical strength. To protect the structures from KOH etching an electroplated layer of nickel was used as protective layer. Structures are fabricated with electroplated gold leads to ensure low resistance.
Keywords :
electroplating; mechanical strength; micromachining; multichip modules; silicon; Si; electroplated protective layer; fabrication methods; flexible substrates; high-density packaging; mechanical strength; micromachining; multichip modules; Acoustic beams; Etching; Fabrication; Force measurement; Gold; Materials testing; Probability; Protection; Silicon; Stress;
Conference_Titel :
Sensors, 2002. Proceedings of IEEE
Print_ISBN :
0-7803-7454-1
DOI :
10.1109/ICSENS.2002.1037161
