• DocumentCode
    381774
  • Title

    Fabrication and characterization of flexible silicon substrates with electroplated gold leads

  • Author

    Lisby, Torben Hilligsøe ; Hansen, Ole ; Branebjerg, Jens Anders

  • Author_Institution
    DELTA Danish Electron., Light & Acoust., Horsholm, Denmark
  • Volume
    1
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    568
  • Abstract
    A study was undertaken to fabricate flexible silicon substrates for high-density packaging. Two different fabrication methods were evaluated to obtain the best mechanical strength. To protect the structures from KOH etching an electroplated layer of nickel was used as protective layer. Structures are fabricated with electroplated gold leads to ensure low resistance.
  • Keywords
    electroplating; mechanical strength; micromachining; multichip modules; silicon; Si; electroplated protective layer; fabrication methods; flexible substrates; high-density packaging; mechanical strength; micromachining; multichip modules; Acoustic beams; Etching; Fabrication; Force measurement; Gold; Materials testing; Probability; Protection; Silicon; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2002. Proceedings of IEEE
  • Print_ISBN
    0-7803-7454-1
  • Type

    conf

  • DOI
    10.1109/ICSENS.2002.1037161
  • Filename
    1037161
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=381774